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Tantalumsilicafilm is a spin-on solution which yields a film consisting of tantalum oxide and silicon dioxide. The solution is applied by spinning at 3000 rpms for 15 seconds in air. After spinning, the film should be baked at 200oC for 60 minutes in air. This is followed by a bake at 400oC in air for 15 minutes.

After the baking process the film will exhibit an index of refraction of 1.85 - 1.90. The film thickness will be 800 angstroms.

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Material Safety Data Sheet